3216FF1.5-R 1206 Fast Blow SMD Chip Encapsulation Surface Mount
Fuses 32VAC DC 1.5A With UL CSA RoHS Reach Approved
Benefit
Small size with high current ratings
Excellent temperature stability
High reliability and resilience
Strong arc suppression characteristics
Environmental data
• Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 °C
to +125 °C)
• Vibration: MIL-STD-202, Method 204, Test Condition C (55 Hz - 2
kHz, 10 G)
• Moisture Resistance: MIL-STD-202, Method 106,10 day cycle
• Solderability: ANSI/J-STD-002, Test B
• Additional resistance to solder heat test: MILSTD-202G Method
210F Condition A
• Operating Temperature: -55 ºC to +125 ºC
• AEC-Q200 qualified (250 mA to 7 A)
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General
Fast-acting fuses help provide overcurrent protection on systems
using DC power sources up to 63VDC. The fuse's
monolithic,multilayer design provides the highest hold current in
the smallest footprint, reduces diffusion-related aging, improves
product reliability and resilience, and enhances high temperature
performance. This helps facilitate the development of more
reliable, high-performance consumer electronics such as laptops,
multimedia devices, cell phones, and other portable electronics.
Features
Multilayer monolithic structure with glass ceramic body and silver
fusing element
Silver termination with nickel and pure-tin solder plating,
providing excellent solderability
AEC-Q200 qualified (250 mA to 7 A)
Fast-acting surface mount fuse
Ratings up to 30 amps
Excellent temperature and cycling characteristics
Compatible with reflow and wave solder
RoHS compliant
High temperature performance
-55°C to +125°C operating range
Soldering method
• Wave Immersion: 260 °C, 10 sec max.
• Infrared Reflow: 260 °C, 30 sec max.
Packaging
| Package data |
| Part Number | Description |
| 12 100 X | 3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA
Standard RS481 |
Application
Circuit Protecting in LCD monitors, PC cards, disk drives, portable
communication products, PDAs, digital cameras, DVDs, TVs, cell
phones, rechargeable battery packs, battery chargers, etc.
Material Specifications
| Construction Body Material | Ceramic |
| Termination Material | Silver, Nickel, Tin |
| Fuse Element | Sliver |
| Terminal Strength | Hanging test:
0603: 0.5kg 30 seconds;
1206 1.5kg, 30 seconds;
0402 part types meet 2-pound push test |
Reliability Tests
| No. | Test | Requirement | Test Condition | Test reference |
| 1 | Soldering heat resistance | DCR change ≤±10%
No mechanical damage | One dip at (260±5)℃ for (5±1) sec | MIL-STD-202
Method 210 |
| 2 | Solderability | Minimum 95% coverage | One dip at (235±5)℃ for (5±1) sec | MIL-STD-202
Method 208 |
| 3 | Thermal shock | DCR change ≤±10%
No mechanical damage | 1000 cycles between -45 ℃ and +125℃ | Refer to Ao littel Standard |
| 4 | Moisture resistance | DCR change ≤±15%
No mechanical damage | 10 cycles | MIL-STD-202
Method 106 |
| 5 | Mechanical vibration | DCR change ≤±10%
No mechanical damage | 0.4" D.A. or 30 G between 5- 3000 Hz | MIL-STD-202
Method 204 |
| 6 | Mechanical shock | DCR change ≤±10%
No mechanical damage | Fall from 1 m height of the floor 10 times | MIL-STD-202 Method 213 |
| 7 | Terminal strength | DCR change ≤±10%
No mechanical damage | 30 sec. hanging for 1206 (1.0kg) and 0603 (0.5KG) | Refer to Ao littel Standard |
| 8 | Life | No electrical "opens" during testing voltage drop change shall be
less than±20% of initial value | 80% Rated current ambient temperature +25℃ to +28 ℃,2000 hours | Refer to Aolittel Standard |
| 9 | Bending | No electrical "opens" during testing | 2 mm bending ,more than 5 seconds | Refer to Ao littel Standard |
Cautions and warnings:
1,Handling CHIP FUSE must not be dropped. Chip-offs must not be
caused during handling of FUSEs. Components must not be touched
with bare hands. Gloves are recommended. Avoid contamination of
fuse surface during handling.
2,Soldering Use resin-type flux or non-activated flux. Insufficient
preheating may cause ceramic cracks. Rapid cooling by dipping in
solvent is not recommended. Complete removal of flux is
recommended.
3,Mounting Electrode must not be scratched before/during/after the
mounting process. Contacts and housings used for assembly with
fuses have to be clean before mounting. During operation, the
fuse’s surface temperature can be very high (ICL). Ensure that
adjacent components are placed at a sufficient distance from the
fuse to allow for proper cooling of the fuses. Ensure that adjacent
materials are designed for operation at temperatures comparable to
the surface temperature of the fuse. Be sure that surrounding parts
and materials can withstand this temperature. Avoid contamination
of fuse surface during processing.
4,Operation Use fuses only within the specified operating
temperature range. Environmental conditions must not harm the
fuses. Use fuses only in normal atmospheric conditions. Contact of
chip fuses with any liquids and solvents should be prevented. It
must be ensured that no water enters the chip fuse (e.g. through
plug terminals). For measurement purposes (checking the specified
resistance vs. temperature), the component must not be immersed in
water but in suitable liquids (e.g. Galden). Avoid dewing and
condensation.
Notice: Specifications of the products displayed herein are subject to
change without notice. We assume no responsibility or liability for
any errors or inaccuracies. Information contained herein is
intended to provide a product description only. No license, express
or implied, by estoppel or otherwise, to any intellectual property
rights is granted by this document. Except as provided in
Aolittel's terms and conditions of sale for such products, Aolittel
assumes no liability whatsoever, and disclaims any express or
implied warranty, relating to sale and/or use of Wayon products
including liability or warranties relating to fitness for a
particular purpose, merchantability, or infringement of any patent,
copyright, or other intellectual property right. Specifications are
subject to change without notice.
